P/N: CLP0556
Others > CLP0556
Design Specification
 
CLP0556
 

Features

- Multi-orientation heat sink design provide sufficient airflow to VRM, chipset and memory area.
- Optimal fin ratio and fan combination provide a cost-effective solution with good thermal performance.
- Spring/screw and back plate provide robust fixing with board during shipping.
- Silent operation.


Key Points

Top View

Bottom View

Side View

Back Plate

Dimension