USD: $34.99
  P/N: CL-P0200
   
    
 
 
  1. Feature
  2. Specification
  3. Gallery
  4. Award & Review
  5. Download
  6. FAQ
Feature
Specification
  
Compatibility   
Phenom (Socket AM2, AM2+)
AMD Athlon 64 (Socket 754/939)
AMD Athlon 64 FX (Socket 939/940)
AMD Sempron (Socket 754)
AMD Opteron (Socket 940)
Heatsink Dimension    91 x 85 x39 mm
Heatsink Material    Copper Base & Aluminum Fin
Heatpipe    Copper Tube 6 mm x 2 pcs
Fan Dimension    80 x 80 x 20 mm
Fan Speed    2000 ± 30 % RPM
Bearing Type   
Noise Level    19 dBA
Max. Air Flow    33.38 CFM
Max. Air Pressure    1.14 mm H2O
LED Fan    N/A
Power Connector    3-pin
Rated Voltage    12V
Started Voltage    5V
Rated Current   

0.10A

Power Input    1.20W
MTBF    30,000 Hours
Weight    508g
Gallery
      Angle View

      Base View

      Top View

Award & Review
Previous Next
Download
NameTypeSizeRelease DateDescription
User Manual 721722 05/12/2008
FAQ
 
Q:  Why is copper based heat sink better than aluminum based solution?
A:  The short answer to the question is the fact that copper conducts heat better than aluminum.  Engineers utilize thermal conductivity (W/m*K) value to measure the effectiveness of a material.  In this case, copper has a thermal conductivity of ~401 W/m*K and aluminum is ~237 W/m*K.  To put it in perspective, wood has a thermal conductivity value of 0.04 ~ 0.4 W/m*K and concrete is 1.7 W/m*K, that is why wood does not get quiet as hot as concrete on a hot sunny day.

Q:  What are the Advantages of heatpipe technology?
A:  Heatpipes are generally small copper tubes filled with a fluid which has a very low boiling point, which enables it to move large quantity of heat with little difference in temperature between "hot" and "cold" interfaces.   The fluids within the heatpipe are moved by capillary action.  Heatpipe uses this to quickly transfer heat away from the CPU, reducing temperatures considerably while allowing heatsink manufacturers to reduce the weight of the heatsink.It also allows for the heatsink fins to be placed farther away from motherboard components. By placing the fins closer to chassis fans, the exhausted air can be removed from the case more efficiently