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Patent Information
Country Patent No.
Taiwan
M 298165
M 313808

Extension of V1 cooler design
V shape architecture heat-pipe cooling
Copper fins & copper heat-pipe can conduct heat efficiently
Extruded aluminum heat spreaders provide larger heat dissipation surface
Angle adjustable heat-pipe & fins to maximize mechanical fitting compatibility



 
Application View
Thermal Module
Heatpipe
V1 Copper Fin
Heat Spreader
Top View
Angle Adjustable Design
   
   

Dimension
 
 


P/N
CL-R0028
Compatibility
DDR, DDR2 RAM
Dimension
155.8(L)x20.3(W)x114.6(H)mm
Heat spreader
Aluminum
Thermal module
Ø 6mm Heatpipe + Copper fin
Weight
155g

Over View
Features
Specification
Specification
Specification
Specification












 
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