Patent Application:
1. Taiwan Patent No. M269697
2. China Patent Application No. 200520143163.1
3. U.S. Patent Application No. 11/292,564
4 in 1 Cooler
Heatpipe
Performance
Low Noise
Application for Intel P4 LGA 775, and AMD K7, K8
6 Heatpipes , transfer the heat quickly
High density aluminum fins provide more surface area for good heat dissipation
Copper base solder , perfect contact to ensure the best performance
12 cm silent fan , perform well at low noise, 16dB only
Side View A
Side View B
Heatpipe technology
High Density Tiny Fin
12cm ultra silent fan
Clips for LGA775, K8, P4, and K7
P/N
CL-P0114
Compatibility
Intel P4 LGA775
Intel P4 478 Prescott FMB1.5
AMD Athlon 64 / Athlon 64 FX
AMD Athlon XP up to 3400+
AMD Sempron up to 3400+
Heatsink Dimension
122 x 122 x 103 mm
Heatsink
Material
Copper Base & Aluminum Fin (142Fin)
Heatpipe
Copper Tube ( 6 mm) x 6 pcs
Fan Dimension
120 x 120 x 25 mm
Max. Air Flow
54.4 CFM
Rated
Voltage
12V
Max. Air Pressure
1.87 mm H2O
Started Voltage
7V
Noise
16dBA
Power Input
3.6W
Connector
3 Pin
Fan Speed
1300 ±10% RPM
Weight
813 g (28.70 oz)
Copyright (c) 2005 Thermaltake Technology Co., Ltd. All Rights Reserved.
"Tt", Thermaltake, Thermaltake are trademarks of Thermaltake Technology Co., Ltd.
All other registered trademarks belong to their respective companies.
6 mm) x 6 pcs 
