USD: $54.99
  P/N: CL-P0268
   
    
 
 
  1. Feature
  2. Specification
  3. Gallery
  4. Award & Review
  5. Download
  6. FAQ
Feature
Specification
  
Compatibility   
Pentium D (Socket LGA 775)
Pentium 4 (Socket LGA775)
Celeron D (Socket LGA775)
Athlon 64 X2 (Socket 939/AM2)
Athlon 64 FX (Socket 939/AM2)
Athlon 64 (Socket 754.939/AM2)
Sempron (Socket 754)
Heatsink Dimension    4.4 x 3.7 x 4.9 inch (L)x(W)x(H)
112 x 94 x 125 mm (L)x(W)x(H)
Heatsink Material    Copper Base & Copper Fin
Heatpipe   
Copper Tube 6mm x 6 pcs.
Fan Dimension   
92 x 92 x 38 mm
Fan Speed   
2200 ± 10% RPM
Bearing Type   
Noise Level    18 dBA
Max. Air Flow    38.7 CFM
Max. Air Pressure   
2.69 mm H2O
LED Fan    N/A
Power Connector    3-pin
Rated Voltage    12V
Started Voltage    6V
Rated Current   
Power Input    2.88W
MTBF   
Weight    623g
Gallery
      Angle View

      Top View

Award & Review
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Download
NameTypeSizeRelease DateDescription
User Manual 1081794 05/09/2008
FAQ
 
Q:  Why is copper based heat sink better than aluminum based solution?
A:  The short answer to the question is the fact that copper conducts heat better than aluminum.  Engineers utilize thermal conductivity (W/m*K) value to measure the effectiveness of a material.  In this case, copper has a thermal conductivity of ~401 W/m*K and aluminum is ~237 W/m*K.  To put it in perspective, wood has a thermal conductivity value of 0.04 ~ 0.4 W/m*K and concrete is 1.7 W/m*K, that is why wood does not get quiet as hot as concrete on a hot sunny day.

Q:  What are the Advantages of heatpipe technology?
A:  Heatpipes are generally small copper tubes filled with a fluid which has a very low boiling point, which enables it to move large quantity of heat with little difference in temperature between "hot" and "cold" interfaces.   The fluids within the heatpipe are moved by capillary action.  Heatpipe uses this to quickly transfer heat away from the CPU, reducing temperatures considerably while allowing heatsink manufacturers to reduce the weight of the heatsink.It also allows for the heatsink fins to be placed farther away from motherboard components. By placing the fins closer to chassis fans, the exhausted air can be removed from the case more efficiently