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LGA775, K8, AM2 |
Heatpipe x6 |
Performance |
Low Noise |
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Best performance, supports up to TDP 130W |
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Heatsink: |
- 6 heatpipes, maximized heat transfer |
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- All copper structure, provides extremely fast heat conductivity |
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- 0.2mm thick copper fins and perfect fin rate, perfect weight-to-performance ratio |
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- Waved fins to reduce wind shearing noise |
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3 in 1 application |
- For LGA775: push pin design for faster install |
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- For K8 and latest socket AM2, tool-less clip, easy to install |
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RX Type Flow |
- Powerful 9238 reversed fan to reduce the noise from air-rebounding, only 18dBA |
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0.2mm thin fin |  |
Waved copper fins | ||||||
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Copper base |  |
Heatpipes | ||||||
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Heatpipes |  |
Heatpipes | ||||||
RX Type Flow  |
Special reversed fan reduces the noise from air-rebounding and create better air flow for heat dissipation |
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