CL-P0114

Patent Application:
1. Taiwan Patent No. M269697
2. China Patent Application No. 200520143163.1
3. U.S. Patent Application No. 11/292,564



4 in 1 Cooler
Heatpipe
Performance
Low Noise

Application for Intel P4 LGA 775, and AMD K7, K8
6 Heatpipes , transfer the heat quickly
High density aluminum fins provide more surface area for good heat dissipation
Copper base solder , perfect contact to ensure the best performance
12 cm silent fan , perform well at low noise, 16dB only

Side View A
Side View B
Heatpipe technology
High Density Tiny Fin
12cm ultra silent fan
Clips for LGA775, K8, P4, and K7