USD :$ 52.99
  P/N: CL-P0257
   
    
 
 
  1. Feature
  2. Specification
  3. Gallery
  4. Award & Review
  5. Download
  6. FAQ
Feature
Specification
  
Compatibility    Intel® Core 2 Extreme / Quad / Duo (Socket LGA775)
Intel® Pentium D / 4 (Socket LGA775)
Intel® Pentium (Socket LGA775)
Intel® Celeron D (Socket LGA775)
Intel® Celeron (Socket LGA775)

AMD® Latest Llano & 6-Core Processors
AMD® Llano Processors (Socket FM1)

AMD® Phenom II X6 / X4 / X3 / X2 (Socket AM3/AM2+)
AMD® Phenom X4 / X3 (Socket AM3/AM2+)
AMD® Athlon II X4 / X3 / X2 (Socket AM3)
AMD® Athlon 64 FX / X2 (Socket AM2/939)
AMD® Athlon 64 (Socket AM2/939/754)
AMD® Sempron (Socket AM2/939/754)

* Supports All CPUs up to 95W TDP

Heatsink Dimension   

140 (L) x 140 (W) x 66 (H) mm
5.51 (L) x 5.51 (W) x 2.6 (H) in

Heatsink Material    Copper Base & Aluminum Extrusion
Heatpipe    N/A
Fan Dimension    120 x 24.3 mm
Fan Speed    1700 ± 10% RPM
Bearing Type   
Noise Level    17 dBA
Max. Air Flow    77.85 CFM
Max. Air Pressure    1.80 mmH2O
LED Fan   

Blue Color

Power Connector    3-pin
Rated Voltage    12V
Started Voltage    7V
Rated Current   
Power Input    3W
MTBF    30,000 Hours
Weight    869g
Gallery
      Angle View

      Side View

      Angle View

      Top View

Award & Review
Previous Next
Download
NameTypeSizeRelease DateDescription
User Manual 621407 05/09/2008
FAQ
 
Q:  Why is copper based heat sink better than aluminum based solution?
A:  The short answer to the question is the fact that copper conducts heat better than aluminum.  Engineers utilize thermal conductivity (W/m*K) value to measure the effectiveness of a material.  In this case, copper has a thermal conductivity of ~401 W/m*K and aluminum is ~237 W/m*K.  To put it in perspective, wood has a thermal conductivity value of 0.04 ~ 0.4 W/m*K and concrete is 1.7 W/m*K, that is why wood does not get quiet as hot as concrete on a hot sunny day.

 
 

About News Promotion Partners Support Contact

Copyright © 2012 Thermaltake All rights reserved.
"Tt" and "Thermaltake" are trademarks of Thermaltake Inc.
All other registered trademarks belong to their respective companies.