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USD : $59.99
  P/N: CLP0540
   
    
 
 
  1. Feature
  2. Specification
  3. Gallery
  4. Award & Review
  5. Download
  6. FAQ
Feature
Specification
  
Compatibility   

Intel® Core i7 (Socket LGA1366)
Intel® Core 2 Extreme (Socket LGA775)
Intel® Core 2 Quad (Socket LGA775)
Intel® Core 2 Duo (Socket LGA775)
Intel® Pentium D (Socket LGA775)
Intel® Pentium 4 (Socket LGA 775)
Intel® Celeron D (Socket LGA775)
Intel® Celeron (Socket LGA775)
AMD® Phenom II X4/X3/X2 (Socket AM3/AM2+)
AMD® Phenom X4/X3 (Socket AM3/AM2+)
AMD® Athlon 64 FX (Socket AM2)
AMD® Athlon 64 X2 (Socket AM2)
AMD® Athlon 64 (Socket AM2)
AMD® Sempron (Socket AM2/)

Heatsink Dimension    126(L) x 71(W) x 70(H) mm
4.96(L) x 2.8(W) x 2.76(H) in
Heatsink Material    Aluminum Fins
Aluminum Extrusion Cover + Copper Base
Heatpipe    Ø 6 mm x 4
Fan Dimension    Ø 120 x 25 mm
Fan Speed    800 ~ 1300 RPM
Bearing Type    Hydro Dynamic
Noise Level    16 dBA
Max. Air Flow    58.3 CFM
Max. Air Pressure    1.4 mmH2O
LED Fan   
Power Connector    3 Pins
Rated Voltage    12 V
Started Voltage    7 V
Rated Current   
Power Input   
MTBF    50,000 Hours
Weight    697 g
Gallery
      Angle View

      Front View

      Side View

      Back View

      Top View

      Base View

      Ultimate Copper + Base Architecture

      Application View

Award & Review
Reviewed by TweakNews
 
The highly polished surface is dead flat and there is ample evidence of solder here, promising maximum heat transfer .. 
 
December 07, 2009

Reviewed by Xbitlabs
 
ISGC-400 coolers have one primary advantage: low level of generated noise .. 
 
October 28, 2009

Reviewed by BCCHardware
 
Thanks to its high quality design and great performance it has proven itself to be a very worthy cooler .. 
 
September 07, 2009

Reviewed by Thinkcomputers
 
Supports all the latest CPU Sockets, Secure installation, Low profile design, Decent cooling .. 
 
August 09, 2009

Reviewed by Thinkcomputers
 
Supports all the latest CPU Sockets, Secure installation, Low profile design, Decent cooling .. 
 
August 09, 2009

Reviewed by XtremeComputing
 
ISGC-400 is a great quiet cooler from Thermaltake .. 
 
May 26, 2009

Reviewed by Overclockers Club
 
very nice CPU cooler and will do a great job keeping your precious components cool during those long frag fests .. 
 
May 24, 2009

Reviewed by The Inquirer
 
heat sinks provide sufficiently good performance to run this baby at 4.5 GHz anyway .. 
 
April 04, 2009

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Download
NameTypeSizeRelease DateDescription
User Manual 1126257 04/27/2009 Multi-language(English, German, French, Spanish, Italian)
FAQ
 
Q:  What are the Advantages of heatpipe technology?
A:  Heatpipes are generally small copper tubes filled with a fluid which has a very low boiling point, which enables it to move large quantity of heat with little difference in temperature between "hot" and "cold" interfaces.   The fluids within the heatpipe are moved by capillary action.  Heatpipe uses this to quickly transfer heat away from the CPU, reducing temperatures considerably while allowing heatsink manufacturers to reduce the weight of the heatsink.It also allows for the heatsink fins to be placed farther away from motherboard components. By placing the fins closer to chassis fans, the exhausted air can be removed from the case more efficiently

Q:  Why is copper based heat sink better than aluminum based solution?
A:  The short answer to the question is the fact that copper conducts heat better than aluminum.  Engineers utilize thermal conductivity (W/m*K) value to measure the effectiveness of a material.  In this case, copper has a thermal conductivity of ~401 W/m*K and aluminum is ~237 W/m*K.  To put it in perspective, wood has a thermal conductivity value of 0.04 ~ 0.4 W/m*K and concrete is 1.7 W/m*K, that is why wood does not get quiet as hot as concrete on a hot sunny day.

 
 
 
              
 

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