Thermaltakeusa » Cooler » CPU Cooler » Intel Socket LGA 775

Feature

Specification


Compatibility	Intel® Core 2 Extreme (Socket LGA775) Intel® Core 2 Quad (Socket LGA775) Intel® Core 2 Duo (Socket LGA775) Intel® Pentium D (Socket LGA775) Intel® Pentium (Socket LGA775) Intel® Pentium 4 (Socket LGA 775) Intel® Celeron D (Socket LGA775) Intel® Celeron (Socket LGA775) AMD® Phenom (Socket AM2+) AMD® Athlon 64 FX (Socket AM2) AMD® Athlon 64 X2 (Socket AM2) AMD® Athlon 64 (Socket AM2 AMD® Sempron (Socket AM2)
Heatsink Dimension	90(L) x 97(W) x 140.5(H) mm 3.54(L) x 3.82(W) x 5.61(H) in
Heatsink Material	Aluminum Fins Aluminum Extrusion Cover + Copper Base
Heatpipe	Ø 6 mm x 3
Fan Dimension	Ø 92 x 25 mm
Fan Speed	600 ~ 1600 RPM (PWM)
Bearing Type	Hydro Dynamic
Noise Level	17 dBA
Max. Air Flow	37 CFM
Max. Air Pressure	1.22 mmH_2^O
LED Fan	----
Power Connector	4 Pins (PWM)
Rated Voltage	12 V
Started Voltage	7 V
Rated Current	0.08 A
Power Input	0.96 W
MTBF	50,000 Hours
Weight	475 g

Gallery

Angle View

Side View

Front View

Base View

Mirror Coating Base

Award & Review

Reviewed by Hardware Secrets

ISGC-200 is a good cooler, silentful, efficient and having a fair price tag ..

August 31, 2009

Reviewed by FrostyTech

the Thermaltake ISGC-200 heatsink is a satisfactory cooler ..

June 09, 2009

Reviewed by neoseeker

If silence is what you're aiming for, then it's certainly worth taking a glance at this one ..

June 09, 2009

Reviewed by Thinkcomputers

ISGC-200 is better for mid-size cases as it leaves plenty of room for cable management and airflow and is yet not too tall to hit the side panel of the case ..

May 26, 2009

Reviewed by HiTechLegion

The performance of the Thermaltake ISGC-200 CPU Cooler was great in the noise ..

May 24, 2009

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Download

Name	Type	Size	Release Date	Description
User Manual		2380585	04/27/2009	Multi-languages (English, German, French, Spanish,Italian)

FAQ

What are the Advantages of heatpipe technology?

Heatpipes are generally small copper tubes filled with a fluid which has a very low boiling point, which enables it to move large quantity of heat with little difference in temperature between "hot" and "cold" interfaces. The fluids within the heatpipe are moved by capillary action. Heatpipe uses this to quickly transfer heat away from the CPU, reducing temperatures considerably while allowing heatsink manufacturers to reduce the weight of the heatsink.It also allows for the heatsink fins to be placed farther away from motherboard components. By placing the fins closer to chassis fans, the exhausted air can be removed from the case more efficiently

Why is copper based heat sink better than aluminum based solution?

The short answer to the question is the fact that copper conducts heat better than aluminum. Engineers utilize thermal conductivity (W/m*K) value to measure the effectiveness of a material. In this case, copper has a thermal conductivity of ~401 W/m*K and aluminum is ~237 W/m*K. To put it in perspective, wood has a thermal conductivity value of 0.04 ~ 0.4 W/m*K and concrete is 1.7 W/m*K, that is why wood does not get quiet as hot as concrete on a hot sunny day.