Features Application for Intel LGA775 Performance 115W All copper base & Copper Fins Skived Technology Shin Etsu-G751 interface material, made perform well Bundle with LGA775 back plate

Detail Information
	Tiny Fins		Spring screw
	Back Plate

Dimension	Thermal Analysis

Detail Specifications
P/N	CL-P0187	Max Air Flow	30.5 CFM
Fan Dimension	70x70x10 mm
Heatsink Dimension	90x90x13.5 mm	Max. Air Pressure	4.49 mm H2O
Rated Voltage	12V
Started Voltage	5V	Bearing Type	1 Ball & 1 Sleeve
Rated Current	0.45A	Noise	36 dBA
Power Input	5.4W	Life Expectation	50,000 hrs
		Connector	3 Pin
Fan Speed	4800 10%RPM	Thermal Interface	Shin Etsu-G751

Logo Information
	Performance