Features Application for Intel LGA775 Performance 115W All copper base & Copper Fins, Soldering Technology Shin Etsu-G751 interface material, made perform well Bundle with LGA775 back plate

Detail Information
	Copper Base & Copper Fins Soldering		Spring screw
	Back Plate

Dimension	Thermal Analysis
Q (CFM) Weight (g) Tc (C ) Ta (C ) T (C ) Power (W) R( C/W) 10 765 49.1 27.4 21.7 60.0 0.362 15 765 46.0 27.6 18.4 60.0 0.307 20 765 44.6 27.6 17.0 60.0 0.283 25 765 43.8 27.8 16.0 60.0 0.267 30 765 43.4 27.9 15.5 60.0 0.258 35 765 43.0 27.9 15.1 60.0 0.252 40 765 42.8 27.9 14.9 60.0 0.248

Detail Specifications
P/N	CL-P0172	Hestsink Material	All copper
Heatsink Dimension	90X90X27 mm	Interface Material	Shin ETsu-G751
		Weight	765g

Logo Information
	Performance