Features Dense copper fin , copper base with seamless soldering process Spring Screw design, easy to install Dow Corning TC-5022 , perform well Bundle with Tt Socket F Metal back plate Supports motherboard with 4.1” mounting pitch

Detail Information
	Spring screw		Copper Base
	High Density Copper Fin		Tt Socket F Back plate P/N: CL-O0010

Dimension

Detail Specifications
P/N	CL-P0317	Heatsink Dimension	115(L)x74(W)x27(H)mm
Compatibility	AMD Opteron 800/8000series, Socket F(1207) AMD Opteron 200/2000series, Socket F(1207)	Heatsink Material	All Copper
		Interface Material	Dow Corning TC-5022
Recommend System	1U Rackmonut System	Weight	498g