You are at  
Cooling System Power by ITBU
 

Features
Application for Intel Xeon Dempsey 2U active solution
Low noise and silent server cooler
All copper soldering Technology
Heat-pipe designation provide better heat conductivity
Dow Corning 5022 Interface material performs well
PerformanceHeatpipe x2Low Noise
Low Noise


Detail Information
Spring Screw Dual Heatpipe

Dimension


Performance


Detail Specifications
P/N
CL-P0303
Bearing
1B1S
Heat-sink Dimension
86.5X76.2X50.29 mm
Fan Speed
3600 RPM (PWM)
Heat-sink Material
Cu Base w/ Cu Fin
Noise Level
29.1dB
4 Pin
Socket Type
LGA 771
Connector
Fastener
Spring Screw
Life Expectancy
40,000 Hrs
Fan Dimension
70X70X15 mm
Tim
Dow Corning 5022
Air Flow
23.49 CFM
Total Weight
699g
Air Pressure
2.23 mmH2O
   
Search
 

Copyright © 2003 Thermaltake Technology Co., Ltd. All Rights Reserved.
"Tt", Thermaltake, ThermalTake are trademarks of Thermaltake Technology Co., Ltd.
All other registered trademarks belong to their respective companies.