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Detail Information
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Cu Base w/ Cu Fin |
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Spring Screw |
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Detail
Specifications |
P/N |
CL-P0263 |
Fastener |
Spring Screw |
Socket Type |
LGA 771 |
Interface Material |
Dow Corning 5022 |
Heatsink Dimension |
86.9 x 78.7 x 20.5 mm |
Weight |
530 g |
Hest-sink Material |
Cu Base w/ Cu Fin |
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Copyright © 2003 Thermaltake Technology Co., Ltd. All Rights
Reserved.
"Tt", Thermaltake, ThermalTake are trademarks of
Thermaltake Technology Co., Ltd.
All other registered trademarks belong to their respective
companies.
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