Features Application for CPU,Chipset and Graphic card Cost effective,high performance thermal interface material Will not dry or harden ,Spreads smoothly and evenly in thin layers Gap fill material between electronic heat sources and heat sinks Durable syringe design-easy to handle Excellent Stability, even at high temperatures

Detail Information
	Easy to handle		Reinforced cover for secure storage
	Package View

Detail Specifications
P/N	A2014			Material	Silicone ,Metal Oxide , Silicone oil
Color	White			Weight	2g
Thermal Conductivity	>1.0w/mk			Operation Temperature	-10°C ~ 180°C

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